3D Dynamic Focus System一FR10-U

Tlhaloso e Khutšoanyane:

3-axis e kheloha likarolo

tšehetso ea wavelength: 355nm

XY2-100 protocol

sebaka sa mosebetsi: 100 * 100mm ho 600 * 600mm

Letšoao le leholo la lebala, lets'oao la 3D, lets'oao le kobehileng holim'a metsi, lets'oao la PCB

 

 


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

B

Moralo o kopaneng, o bonolo ho o kopanya
CNC shell, thibelo ea lerōle, sebopeho sa compact, se bonolo ho se kopanya. Pokello ea data ea bolelele bo tsepameng ha u chencha sebaka sa mosebetsi.

Ho bonolo ho fetola sebaka sa mosebetsi
Konopo ea tokiso e sebelisetsoa ho chencha lipakeng tsa libaka tse fapaneng tsa mosebetsi ntle le ho nkela likarolo tse ling sebaka.

Ho sebetsa ka mokhoa o bonolo oa tšimo e kholo
Moralo oa mojule oa ho khanna habeli oa Z axis dynamic focus, frequency frequency≥100HZ@±10°, ho bonolo ho fihlella botebo ba Z 150mm@300mmx300mm, o sebelisoa sethaleng, ts'ebetso ea lebelo le holimo la 3D.

rwere

Fumana ts'ebeliso ea bokaholimo bo kobehileng ba 600x600x150mm

Ka taolo ea 3rd axis ho fihlela sebaka se seholo sa mosebetsi, boholo bo nyane ba sebaka.

33315

3D Surface Processing

FR10-U e sebelisa thekenoloji ea taolo e matla ea ho tsepamisa maikutlo, e roba moeli oa matšoao a setso, 'me e ke ke ea khopamisa ho tšoaea sebakeng se seholo, bokaholimo ba 3D, litepisi, bokaholimo ba likhoele, letsoapo le lintho tse ling.

C

Ntlha ea bohlokoa ea Kopo

Letšoao le leholo la lebala

E kobehileng bokahodimo

3D tšoaea

PCB tšoaea

555

Likoloi tsa ka hare mokhabiso karolo ea thepa ea phekolo

666

Ho tšoaea lisebelisoa tsa lapeng

777

Etching ea lintho tse khethehileng

888

3D ho tšoaea khalase

Video ea Kopo

Tlhahisoleseding ea Theknoloji ea Sehlahisoa

Lintho Output Voltage(VDC) ± 15VDC
Hona joale(A) 10A
Protocol XY2-100 Protocol
Boima (KG) 7
Boholo(mm) 292*115*152.8
Litlhaloso tsa Optical Aperture size(mmm) 10
Kenya seea-le-moea (mm) 6.5
Litlhaloso tsa Galvanometer Mohala oa sehlahisoa Standard Pro P2
Skena angle(°) ±10 ±10 ±10
Pheta-pheta (μrad) 8 8 5
Max.Gain Drift(ppm/k) 100 100 50
Max.Offset Drift(μrad/k) 30 30 15
Ho hoholeha ha nako e telele ho feta 8h(mrad) ≤0.2 ≤0.2 ≤0.1
Phoso ea ho Latela morao ≤0.13 ≤0.13 ≤0.13
Lebelo le phahameng la ho sebetsa(li-charater/s) 600@100x100 600@100x100 600@100x100
Tšimo e Sebetsang & Diameter ea Spot Sebaka sa Mosebetsi(mm) 125x125x40 200x200x120 300x300x150 400x400x150 500x500x150 600×600x150
The Min.Spot Diameter@1/e2(mm) 0.010 0.015 0.022 0.026 0.033 0.039
Bolelele ba ho tsepamisa maikutlo(mm) 144 234 354 474 594 714

Sets'oants'o sa Mechini

D

FAQs

Lilemo tsa k'hamphani

FEELTEK e thehiloe ka 2014, e ikemiselitse ho sebelisa theknoloji ea 3D laser dynamic focus. Re hlahisa thekenoloji liindastering tse ngata tsa 3D laser processing, tse kang 3D laser marking, fatling, laser welding, drilling, additive production, surface treatment, le mefuta e meng ea litharollo tsa laser processing.

Basebetsi

FEELTK ke k'hamphani e shebaneng le tekheniki. 85% ea basebetsi ba phathahane ka ts'ebetso, sehlopha sa botekgeniki, sa nts'etsopele, ba lla 15% bakeng sa maemo a tsamaiso.

Phaello

Har'a mela ea lihlahisoa, e 'ngoe ea mela ea tlhōlisano ke hlooho ea 3D scan. Kaha re na le likarete tse ikemetseng tsa taolo le software, re ka fana ka matšoao a holim'a 3D, ho betla, ho cheselletsa, ho etsa lintho tse eketsang, ho fetola bokaholimo le mefuta e meng ea tharollo ea laser.


  • E fetileng:
  • E 'ngoe:

  • Ngola molaetsa wa hao mona mme o re romele wona